GPU WORLD · GW-LC-GPU-MI300A
Instinct MI300A APU cold plate
Configuration reviewMatch the cooling assembly to a socketed MI300A accelerated processing unit. The approved SH5 socket stack and server cooling policy determine the design.
Fit and compatibility
- Confirm the MI300A SH5 server board and revision, socket carrier and keep-out envelope. Review the APU retention system and approved mounting load.
- Check the exact processor interface, server power mode and cooling configuration. The MI300A integrates CPU and GPU in one package.
Scope of supply
- Specify an SH5 plate, the approved thermal interface and retention stack, and the required fittings and hose direction.
- Where the quote includes a loop, document the manifold branch, coolant conditions and sensing requirements. Agree the remaining chassis airflow and service procedure.
Operating conditions
- AMD lists 550 W TDP and 760 W peak for MI300A. AMD technical documentation distinguishes a 550 W air configuration and a 760 W liquid configuration. Use the approved setting as one APU load in the heat budget.
- Review the plate performance at the specified inlet temperature and coolant flow. Check the assembly’s mounting force, contact and pressure-drop limits with the exact server documentation.
Acceptance checks
- Inspect the socket stack and check plate fit, contact and hose clearance under the approved service procedure.
- Apply the specified combined CPU and accelerator workload at the selected power mode. Record APU temperatures, branch flow and the approved response to loss of cooling.
Technical references
Use these references to identify the platform and design requirements. GPU WORLD confirms the applicable assembly and operating conditions for each project.
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Plan your cooling project
Our team will review server fit, heat rejection and the scope of supply.