GPU WORLD · GW-LC-CPU-INT-4189
Intel Xeon LGA4189 cold plate
Socket and chassis reviewPlan direct-to-chip CPU cooling for a third-generation Xeon Scalable server. Match the plate and retention hardware to the socket variant, board revision and available space.
Fit and compatibility
- Intel maps third-generation Xeon Scalable processors without an H suffix to LGA4189-4 and those with an H suffix to LGA4189-5. Confirm the complete processor model and the server board socket variant.
- Identify the processor carrier and mounting points from the server documentation. Check the installed plate height, hose bends and outlet orientation against the lid, fan duct and memory slots.
- Record how many CPU sockets are populated and check the clearance around each one. The two socket positions can have different routing constraints.
Scope of supply
- For a two-CPU configuration, define two correctly oriented plates, their matching carriers and fasteners, and the specified thermal interface material.
- List the supply and return hoses, fittings and any required manifold ports by socket position. Confirm whether the quote covers a plate kit or connection to the server coolant loop.
Operating conditions
- Use the configured power for each CPU and the server thermal limits. Intel lists 270 W TDP for the Xeon Platinum 8380 and 250 W for the 8380H, which are processor specifications.
- Check plate thermal performance and pressure drop at the proposed inlet temperature, fluid and flow. Retain airflow across memory, voltage regulators and other components outside the liquid circuit.
Acceptance checks
- Dry-fit the assembly with memory and fan ducts in place. Confirm mounting sequence and torque against the server instructions and inspect the hose path with the lid closed.
- Check for leaks at the agreed test condition, then record CPU temperatures and branch flow under sustained load. Verify the low-flow or pump-failure alarm response.
Technical references
Use these references to identify the platform and design requirements. GPU WORLD confirms the applicable assembly and operating conditions for each project.
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