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GPU WORLD · GW-LC-CPU-INT-7529

Intel Xeon 6 LGA7529 cold plate

High-power thermal review

Review high-power CPU cooling for an LGA7529-1 server. Select the assembly using package geometry, sustained power and the coolant conditions available at the rack.

Illustration of Intel Xeon 6 LGA7529 cold plate
Concept illustration

Fit and compatibility

  • Intel assigns Xeon 6 6900 P-series and Xeon 6+ 6900 E-series processors to LGA7529-1. Confirm the board and firmware support for the particular CPU.
  • Intel specifies a 104.5 × 70.5 mm package and BR1A carrier for the Xeon 6966P-C. Check the heat spreader contact area, carrier and mounting load for the quoted processor.
  • Survey the available height above each socket, the lid clearance and the route from both CPU positions to the manifold.

Scope of supply

  • Quote the plate assembly, matching retention hardware and thermal interface material for each configured CPU. Ask for mechanical tolerances and test data for the proposed assembly.
  • Define the loop interface, including hose routing, manifold connections, branch flow monitoring and the pressure limits of the connected components.

Operating conditions

  • Intel lists 550 W TDP for the Xeon 6966P-C. Use it as a processor example and size each plate using the intended CPU power profile and verified thermal performance at the specified coolant inlet and flow.
  • Review steady and transient loads and check the pump operating point with both sockets active when applicable. Record the pressure drop across each branch at the proposed fluid temperature.

Acceptance checks

  • Review the measured plate temperature and pressure-drop curves against the agreed limits before factory testing. Confirm fastener loading and connector service clearance on the assembled tray.
  • Load all populated sockets together and log CPU power, temperature, throttling and branch flow. Verify the low-flow alarm and the agreed protective response.

Technical references

Use these references to identify the platform and design requirements. GPU WORLD confirms the applicable assembly and operating conditions for each project.

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