GW-LC-GPU-A100-SXM
A100 SXM cold plate
SXM
For HGX A100 assemblies. Confirm the SXM module, baseboard revision, cold plate mounting and memory contact requirements.
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Configure cooling for a single GPU server or a high-density compute rack. Start with the exact hardware and site conditions, then size the cold plates, coolant loop and heat rejection together.
Evaluate a plate, tray or rack integration against the exact accelerator and server configuration. SXM, PCIe, OAM and rack platforms have different mechanical requirements.
GW-LC-GPU-A100-SXM
SXM
For HGX A100 assemblies. Confirm the SXM module, baseboard revision, cold plate mounting and memory contact requirements.
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GW-LC-GPU-H100-SXM
SXM
For HGX H100 systems. Match the SXM module and baseboard to the chassis, hose routing and server manifold.
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GW-LC-GPU-H200-SXM
SXM
For HGX H200 systems. Confirm the baseboard revision, GPU and memory contact surfaces, and supply and return connections.
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GW-LC-GPU-H200-NVL
PCIe retrofit
For H200 NVL PCIe cards. Check the board revision, slot clearance, NVLink bridge space and remaining chassis airflow.
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GW-LC-GPU-B100-SXM
Engineering review
Submit the HGX baseboard part number and chassis model so the mounting pattern, thermal requirements and sourcing can be assessed.
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GW-LC-GPU-B200-SXM
SXM6
For HGX B200 systems. Confirm the SXM6 baseboard, OEM tray, cooling configuration and manifold connections.
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GW-LC-GPU-GB200
Project integration
For Grace Blackwell CPU and GPU assemblies. Match the tray revision, rack manifold interface and coolant requirements.
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GW-LC-GPU-GB300
Project integration
For GB300 NVL72 compute trays. Review the OEM tray, rack manifold, facility loop and required coolant flow together.
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GW-LC-GPU-RP6000-BW-S
PCIe
Confirm the Server Edition card variant, chassis slot and length clearance, and coolant connections for the intended configuration.
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GW-LC-GPU-MI300X
OAM
For MI300X OAM assemblies. Check the baseboard revision, mounting pattern, contact surfaces and coolant routing within the tray.
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GW-LC-GPU-MI300A
SH5 APU
For the socketed SH5 APU. Confirm the server board, retention hardware, socket clearance and selected thermal configuration.
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GW-LC-GPU-MI325X
OAM
For MI325X OAM assemblies. Check the universal baseboard, tray layout, hose routing and flow requirements for the selected server.
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GW-LC-GPU-MI350X
Engineering review
For MI350X OAM projects. Confirm the OEM cooling configuration, baseboard revision and thermal requirements before selecting an assembly.
View details Request a quoteMatch the socket, retention hardware, processor package and chassis clearance. Review the CPU and accelerator loads together when they share a coolant loop.
GW-LC-CPU-INT-4189
LGA4189
For third-generation Xeon Scalable systems. Confirm the LGA4189 socket variant, processor carrier, mounting hardware and chassis clearance.
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GW-LC-CPU-INT-4677
LGA4677
For fourth- and fifth-generation Xeon Scalable and selected Xeon W systems. Verify the carrier, retention hardware and processor power profile.
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GW-LC-CPU-INT-4710
LGA4710-2
For Xeon 6 6500 and 6700 P-series and 6700 E-series platforms. Verify the processor, mounting hardware and server tray.
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GW-LC-CPU-INT-7529
LGA7529-1
For Xeon 6 6900 P-series and Xeon 6+ 6900 E-series systems. Confirm the processor load, plate mounting and available coolant flow.
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GW-LC-CPU-AMD-SP3
SP3
For EPYC 7001, 7002 and 7003 platforms. Confirm socket retention, processor power and hose clearance for the selected chassis.
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GW-LC-CPU-AMD-SP5
SP5
For EPYC 9004 and 9005 systems. Select the plate after confirming the processor power setting, mounting hardware and cooling loop.
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GW-LC-CPU-AMD-SP6
SP6
For single-socket EPYC 8004 and 8005 systems. Confirm mounting fit, chassis clearance and coolant routing before selecting an assembly.
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GW-LC-CPU-CUSTOM-500
Engineering review
Review sustained and peak processor power, contact geometry, coolant temperature, branch flow and chassis clearance before selecting a cold plate.
View details Request a quoteConfigure manifolds, hoses, quick disconnects, coolant distribution units and complete server or rack loops. CDU kW figures are planning classes. Sizing requires performance data for your site conditions.
GW-LC-MAN-04GPU
Server distribution
Distribute supply and return coolant to four GPU branches and optional CPU plates. Confirm branch flow and port orientation.
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GW-LC-MAN-08GPU
Server distribution
Plan coolant distribution for an eight-GPU tray. Check chassis mounting, branch pressure drop, connector spacing and the rack interface.
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GW-LC-QD-SERVER
Coolant connections
Specify low-spill couplings for serviceable server and rack connections. Confirm mating series, seal compatibility, pressure limits and flow requirements.
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GW-LC-HOSE-SERVER
Coolant connections
Match supply and return hoses to chassis routing. Confirm length, inner diameter, bend radius, coolant compatibility and end fittings.
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GW-LC-CDU-08A
8 kW planning class
For lab or single-server projects that reject heat to room air. Confirm ambient temperature, airflow and coolant conditions.
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GW-LC-CDU-12A
12 kW planning class
Assess heat rejection for a four-GPU server using the actual liquid load, room air temperature and available rack space.
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GW-LC-CDU-18A
18 kW planning class
Review higher-load server or lab projects. Confirm room cooling, coolant temperatures and pump performance at the intended duty point.
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GW-LC-CDU-30L
30 kW planning class
Transfer heat from an equipment loop to facility water. Confirm primary and secondary temperatures, flow and allowable pressure drop.
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GW-LC-CDU-65L
65 kW planning class
Size for the combined liquid load from multiple servers. Review facility water conditions, rack manifold connections and pump head.
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GW-LC-CDU-130L
130 kW planning class
Assess dense rack cooling against facility water capacity, coolant temperature, pump redundancy and the air load outside the loop.
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GW-LC-SRV-4GPU-D2C
Server package
Configure four GPU branches with optional CPU cooling. Select the plates, manifold, hoses and CDU for the confirmed chassis and load.
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GW-LC-SRV-8GPU-D2C
Server package
Configure plates, coolant routing and monitoring for an eight-GPU system. Confirm baseboard revision, tray clearances and rack connections before quoting.
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GW-LC-RACK-AI
Rack integration
Plan the CDU, rack manifold and server loops together. Define coolant monitoring, leak response and commissioning checks for the site.
View details Request a quoteLOOP DESIGN
Cold plates transfer heat from selected chips into coolant. The technology cooling loop carries that heat to a coolant distribution unit (CDU). The CDU transfers it to room air or to a separate facility water loop.
Match cold plates to the package, contact area, mounting loads and chassis clearance. Memory, drives, power supplies and other components outside the loop may still need airflow.
Size manifold branches, hoses and connectors for the required flow and pressure drop. Check coolant chemistry, wetted materials, service access and leak detection.
Size the CDU using the heat load, inlet temperatures, flow and heat exchanger approach temperature. Liquid-to-air designs still need adequate room cooling. Liquid-to-liquid designs need compatible facility water.
COMPATIBILITY & QUOTATIONS
Share what you know. GPU WORLD reviews fit, loop requirements, the remaining airflow load and the proposed deployment before preparing a quotation.
Our team will review server fit, heat rejection and the scope of supply.