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GPU WORLD · THERMAL ENGINEERING

Direct-to-chip liquid cooling

Configure cooling for a single GPU server or a high-density compute rack. Start with the exact hardware and site conditions, then size the cold plates, coolant loop and heat rejection together.

Illustration of a liquid-cooled compute rack with coolant distribution hardware
Illustrative rack concept

GPU and accelerator cooling

Evaluate a plate, tray or rack integration against the exact accelerator and server configuration. SXM, PCIe, OAM and rack platforms have different mechanical requirements.

Illustration of A100 SXM cold plate

GW-LC-GPU-A100-SXM

A100 SXM cold plate

SXM

For HGX A100 assemblies. Confirm the SXM module, baseboard revision, cold plate mounting and memory contact requirements.

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Illustration of H100 SXM cold plate

GW-LC-GPU-H100-SXM

H100 SXM cold plate

SXM

For HGX H100 systems. Match the SXM module and baseboard to the chassis, hose routing and server manifold.

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Illustration of H200 SXM cold plate

GW-LC-GPU-H200-SXM

H200 SXM cold plate

SXM

For HGX H200 systems. Confirm the baseboard revision, GPU and memory contact surfaces, and supply and return connections.

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Illustration of H200 NVL PCIe cooling retrofit

GW-LC-GPU-H200-NVL

H200 NVL PCIe cooling retrofit

PCIe retrofit

For H200 NVL PCIe cards. Check the board revision, slot clearance, NVLink bridge space and remaining chassis airflow.

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Illustration of HGX B100 cooling assessment

GW-LC-GPU-B100-SXM

HGX B100 cooling assessment

Engineering review

Submit the HGX baseboard part number and chassis model so the mounting pattern, thermal requirements and sourcing can be assessed.

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Illustration of B200 SXM cold plate

GW-LC-GPU-B200-SXM

B200 SXM cold plate

SXM6

For HGX B200 systems. Confirm the SXM6 baseboard, OEM tray, cooling configuration and manifold connections.

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Illustration of GB200 compute tray cooling

GW-LC-GPU-GB200

GB200 compute tray cooling

Project integration

For Grace Blackwell CPU and GPU assemblies. Match the tray revision, rack manifold interface and coolant requirements.

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Illustration of GB300 rack integration

GW-LC-GPU-GB300

GB300 rack integration

Project integration

For GB300 NVL72 compute trays. Review the OEM tray, rack manifold, facility loop and required coolant flow together.

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Illustration of RTX PRO 6000 Blackwell Server cooling

GW-LC-GPU-RP6000-BW-S

RTX PRO 6000 Blackwell Server cooling

PCIe

Confirm the Server Edition card variant, chassis slot and length clearance, and coolant connections for the intended configuration.

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Illustration of Instinct MI300X cold plate

GW-LC-GPU-MI300X

Instinct MI300X cold plate

OAM

For MI300X OAM assemblies. Check the baseboard revision, mounting pattern, contact surfaces and coolant routing within the tray.

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Illustration of Instinct MI300A APU cold plate

GW-LC-GPU-MI300A

Instinct MI300A APU cold plate

SH5 APU

For the socketed SH5 APU. Confirm the server board, retention hardware, socket clearance and selected thermal configuration.

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Illustration of Instinct MI325X cold plate

GW-LC-GPU-MI325X

Instinct MI325X cold plate

OAM

For MI325X OAM assemblies. Check the universal baseboard, tray layout, hose routing and flow requirements for the selected server.

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Illustration of Instinct MI350X cooling assessment

GW-LC-GPU-MI350X

Instinct MI350X cooling assessment

Engineering review

For MI350X OAM projects. Confirm the OEM cooling configuration, baseboard revision and thermal requirements before selecting an assembly.

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CPU cold plates

Match the socket, retention hardware, processor package and chassis clearance. Review the CPU and accelerator loads together when they share a coolant loop.

Illustration of Intel Xeon LGA4189 cold plate

GW-LC-CPU-INT-4189

Intel Xeon LGA4189 cold plate

LGA4189

For third-generation Xeon Scalable systems. Confirm the LGA4189 socket variant, processor carrier, mounting hardware and chassis clearance.

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Illustration of Intel Xeon LGA4677 cold plate

GW-LC-CPU-INT-4677

Intel Xeon LGA4677 cold plate

LGA4677

For fourth- and fifth-generation Xeon Scalable and selected Xeon W systems. Verify the carrier, retention hardware and processor power profile.

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Illustration of Intel Xeon 6 LGA4710 cold plate

GW-LC-CPU-INT-4710

Intel Xeon 6 LGA4710 cold plate

LGA4710-2

For Xeon 6 6500 and 6700 P-series and 6700 E-series platforms. Verify the processor, mounting hardware and server tray.

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Illustration of Intel Xeon 6 LGA7529 cold plate

GW-LC-CPU-INT-7529

Intel Xeon 6 LGA7529 cold plate

LGA7529-1

For Xeon 6 6900 P-series and Xeon 6+ 6900 E-series systems. Confirm the processor load, plate mounting and available coolant flow.

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Illustration of AMD EPYC SP3 cold plate

GW-LC-CPU-AMD-SP3

AMD EPYC SP3 cold plate

SP3

For EPYC 7001, 7002 and 7003 platforms. Confirm socket retention, processor power and hose clearance for the selected chassis.

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Illustration of AMD EPYC SP5 cold plate

GW-LC-CPU-AMD-SP5

AMD EPYC SP5 cold plate

SP5

For EPYC 9004 and 9005 systems. Select the plate after confirming the processor power setting, mounting hardware and cooling loop.

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Illustration of AMD EPYC SP6 cooling solution

GW-LC-CPU-AMD-SP6

AMD EPYC SP6 cooling solution

SP6

For single-socket EPYC 8004 and 8005 systems. Confirm mounting fit, chassis clearance and coolant routing before selecting an assembly.

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Illustration of Custom high-power CPU cooling

GW-LC-CPU-CUSTOM-500

Custom high-power CPU cooling

Engineering review

Review sustained and peak processor power, contact geometry, coolant temperature, branch flow and chassis clearance before selecting a cold plate.

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Coolant distribution and rack integration

Configure manifolds, hoses, quick disconnects, coolant distribution units and complete server or rack loops. CDU kW figures are planning classes. Sizing requires performance data for your site conditions.

Illustration of Four-GPU liquid cooling manifold

GW-LC-MAN-04GPU

Four-GPU liquid cooling manifold

Server distribution

Distribute supply and return coolant to four GPU branches and optional CPU plates. Confirm branch flow and port orientation.

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Illustration of Eight-GPU liquid cooling manifold

GW-LC-MAN-08GPU

Eight-GPU liquid cooling manifold

Server distribution

Plan coolant distribution for an eight-GPU tray. Check chassis mounting, branch pressure drop, connector spacing and the rack interface.

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Illustration of Server quick-disconnect kit

GW-LC-QD-SERVER

Server quick-disconnect kit

Coolant connections

Specify low-spill couplings for serviceable server and rack connections. Confirm mating series, seal compatibility, pressure limits and flow requirements.

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Illustration of Server coolant hose assembly

GW-LC-HOSE-SERVER

Server coolant hose assembly

Coolant connections

Match supply and return hoses to chassis routing. Confirm length, inner diameter, bend radius, coolant compatibility and end fittings.

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Illustration of Liquid-to-air CDU

GW-LC-CDU-08A

Liquid-to-air CDU

8 kW planning class

For lab or single-server projects that reject heat to room air. Confirm ambient temperature, airflow and coolant conditions.

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Illustration of Liquid-to-air CDU

GW-LC-CDU-12A

Liquid-to-air CDU

12 kW planning class

Assess heat rejection for a four-GPU server using the actual liquid load, room air temperature and available rack space.

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Illustration of Liquid-to-air CDU

GW-LC-CDU-18A

Liquid-to-air CDU

18 kW planning class

Review higher-load server or lab projects. Confirm room cooling, coolant temperatures and pump performance at the intended duty point.

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Illustration of Liquid-to-liquid rack CDU

GW-LC-CDU-30L

Liquid-to-liquid rack CDU

30 kW planning class

Transfer heat from an equipment loop to facility water. Confirm primary and secondary temperatures, flow and allowable pressure drop.

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Illustration of Liquid-to-liquid rack CDU

GW-LC-CDU-65L

Liquid-to-liquid rack CDU

65 kW planning class

Size for the combined liquid load from multiple servers. Review facility water conditions, rack manifold connections and pump head.

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Illustration of Liquid-to-liquid rack CDU

GW-LC-CDU-130L

Liquid-to-liquid rack CDU

130 kW planning class

Assess dense rack cooling against facility water capacity, coolant temperature, pump redundancy and the air load outside the loop.

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Illustration of Four-GPU direct-to-chip cooling package

GW-LC-SRV-4GPU-D2C

Four-GPU direct-to-chip cooling package

Server package

Configure four GPU branches with optional CPU cooling. Select the plates, manifold, hoses and CDU for the confirmed chassis and load.

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Illustration of Eight-GPU direct-to-chip cooling package

GW-LC-SRV-8GPU-D2C

Eight-GPU direct-to-chip cooling package

Server package

Configure plates, coolant routing and monitoring for an eight-GPU system. Confirm baseboard revision, tray clearances and rack connections before quoting.

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Illustration of AI rack liquid cooling package

GW-LC-RACK-AI

AI rack liquid cooling package

Rack integration

Plan the CDU, rack manifold and server loops together. Define coolant monitoring, leak response and commissioning checks for the site.

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LOOP DESIGN

How the heat leaves the server

Cold plates transfer heat from selected chips into coolant. The technology cooling loop carries that heat to a coolant distribution unit (CDU). The CDU transfers it to room air or to a separate facility water loop.

  1. 01 · Capture heat

    Match cold plates to the package, contact area, mounting loads and chassis clearance. Memory, drives, power supplies and other components outside the loop may still need airflow.

  2. 02 · Distribute coolant

    Size manifold branches, hoses and connectors for the required flow and pressure drop. Check coolant chemistry, wetted materials, service access and leak detection.

  3. 03 · Reject heat

    Size the CDU using the heat load, inlet temperatures, flow and heat exchanger approach temperature. Liquid-to-air designs still need adequate room cooling. Liquid-to-liquid designs need compatible facility water.

COMPATIBILITY & QUOTATIONS

Tell us what you’re cooling

Share what you know. GPU WORLD reviews fit, loop requirements, the remaining airflow load and the proposed deployment before preparing a quotation.

  • Server or rack: chassis model, board revision, unit count and available rack space.
  • Accelerators and CPUs: exact models, form factors, processor sockets and quantities.
  • Cooling scope: cold plate, server loop, CDU or rack integration, plus estimated load.
  • Site conditions: facility water or room cooling, temperatures, coolant, flow and project location.
CONFIGURATION & QUOTATIONSRequest a cooling quoteShare your server configuration and site conditions.Request a quote

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