GPU WORLD · GW-LC-GPU-MI325X
Instinct MI325X cold plate
Configuration reviewEvaluate an MI325X OAM cooling assembly for the selected universal baseboard and server tray, with branch flow checked against the higher device heat load.
Fit and compatibility
- Identify the MI325X OAM part number, baseboard revision and tray. Check the MI325X GPU and HBM3E contact requirements, retention and hose clearances against the approved drawing.
- Confirm the actual GPU population, server power mode and tray cooling architecture. Qualify any shared parts with the system manufacturer for that revision.
Scope of supply
- Specify the approved plate, thermal interfaces, mounting hardware and identified coolant ports for each module.
- For an eight-GPU loop, define the branch arrangement, tray manifold, connectors and instrumentation. Include the rack CDU or facility connection only where agreed.
Operating conditions
- AMD lists 1,000 W peak board power for MI325X. An eight-module scenario at that peak represents 8 kW of device power before other loads. Size heat rejection using the documented liquid fraction and actual operating conditions.
- Verify the plate thermal curve, inlet coolant limit and pressure drop for the specific assembly. Check total and per-branch flow with the real tray and rack interfaces.
Acceptance checks
- Measure the installed branch flow and supply-to-return temperature change during the agreed load soak.
- Check memory and module thermal behavior and verify that the tray’s air-cooled components remain within their limits. Record alarms and inspect the connectors after the approved service test.
Technical references
Use these references to identify the platform and design requirements. GPU WORLD confirms the applicable assembly and operating conditions for each project.
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Plan your cooling project
Our team will review server fit, heat rejection and the scope of supply.