NVIDIA · Integrated GPU platform / module
NVIDIA GH200 NVL2
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Product overview
NVIDIA GH200 NVL2. Integrated GPU module, baseboard or system reference. The model identifies the platform; the complete supplied configuration is specified separately. NVIDIA model-level reference specifications — reference memory / capacity: Up to 288 GB HBM3e GPU aggregate + up to 960 GB CPU LPDDR5X; interface: Integrated Grace/Hopper CPU+GPU with NVLink-C2C; form factor: Dual-superchip integrated server platform. Confirm the exact OEM configuration and its host, power, cooling and interconnect requirements before ordering.
Configuration overview
This is an integrated GPU module or system platform with host-specific requirements. Confirm the exact module or complete-system scope, interconnect, power, cooling and supported software in your quotation.
Specifications & compatibility
NVIDIA REFERENCE SPECIFICATIONS
Technical specifications
Specifications describe the identified NVIDIA model or reference configuration. Board-partner designs, OEM firmware, laptop power limits and complete-system configurations can differ.
- Product type
- Integrated CPU/GPU superchip platform
- CPU/GPU configuration
- 2 Grace CPU(s) + 2 Hopper GPU(s)
- CPU core count
- 144
- CPU cores
- Arm Neoverse V2
- CPU LPDDR5X memory
- Up to 960 GB; 240/480 GB options
- GPU HBM memory
- Up to 288 GB HBM3e aggregate
- GPU memory bandwidth
- Up to 9.8 TB/s aggregate
- FP64 peak
- 68 TFLOPS aggregate
- FP32 peak
- 134 TFLOPS aggregate
- FP64 Tensor peak
- 134 TFLOPS aggregate
- FP16 / BF16 Tensor peak
- 1,979 TFLOPS dense / 3,958 TFLOPS sparse, aggregate
- FP8 Tensor peak
- 3,958 TFLOPS dense / 7,916 TFLOPS sparse, aggregate
- NVLink-C2C
- 900 GB/s per Grace-Hopper CPU/GPU connection
- Maximum PCIe links
- Up to 8 x PCIe Gen5 x16
- CPU+GPU+memory power
- 900-2,000 W configurable
- Cooling
- Air-cooled or liquid-cooled, platform-specific
GPU HBM memory and CPU LPDDR5X memory are different physical memories connected coherently; do not add them and call the sum GPU VRAM. Confirm HBM3 vs HBM3e and exact host/cooling variant.
- Capacity / memory
- Up to 288 GB HBM3e GPU aggregate + up to 960 GB CPU LPDDR5X
- Interface
- Integrated Grace/Hopper CPU+GPU with NVLink-C2C
- Form factor
- Dual-superchip integrated server platform
An integrated platform or module. Confirm its supported host, interconnect, power and cooling configuration.
Complete/integrated system enquiry, not an ordinary standalone PCIe board. Do not treat HGX, DGX, Grace Blackwell and individual GPU modules as interchangeable.
Official platform identity; quote complete supported configuration
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Match the part to its host.
NVIDIA model names identify GPUs and product editions; they do not establish one universal board-vendor part number. Laptop GPUs are supplied within complete laptops. SXM modules, HGX/DGX systems and integrated CPU–GPU platforms require their supported host and interconnect.
Memory type, rank, transfer rate and population rules must match the server and CPU. A storage capacity does not establish NVMe, SATA or SAS compatibility. SSD and mechanical HDD media, firmware, sector format, carriers and security variants need separate checks.
For a precise quotation, send:
- Complete manufacturer/OEM part number and label, including suffix.
- Quantity, acceptable condition and delivery city/country.
- Server, motherboard, CPU or storage-backplane model.
- Application, required configuration and compatibility requirements.
Where a price is not displayed, call or WhatsApp for the current USD price. Confirm equipment condition, quantity, warranty, shipping and dispatch before ordering.
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