GPU WORLD · GW-LC-GPU-MI300X
Instinct MI300X cold plate
Configuration reviewAssess a cold-plate assembly for an MI300X OAM accelerator on the exact OEM universal baseboard. Confirm the tray and module layout before selecting the cooling hardware.
Fit and compatibility
- Confirm the MI300X OAM module and universal baseboard revision, chassis and accelerator population. MI300A uses a separate socketed APU mounting arrangement.
- Check the GPU and HBM3 contact layout, module retention, connector locations and interference near the interconnects and neighboring boards.
Scope of supply
- Define the supported OAM plate, thermal interface and retention hardware from the OEM drawings.
- For a complete tray loop, scope branch hoses, connectors and manifold routing. Confirm which baseboard components require dedicated airflow.
Operating conditions
- AMD lists 750 W peak board power for MI300X. Use the installed power configuration, supported coolant, target temperatures and supplier flow curves to establish the loop operating point.
- Evaluate flow distribution across the installed modules and the total pressure drop in the tray, manifold and quick disconnects. Check that the pump still meets minimum branch flow after integration.
Acceptance checks
- Confirm approved retention and contact, then verify connector integrity and coolant flow at the assembled tray.
- Run the agreed accelerator and memory workload with all intended modules populated. Record thermal and performance indicators, branch conditions and residual baseboard temperatures.
Technical references
Use these references to identify the platform and design requirements. GPU WORLD confirms the applicable assembly and operating conditions for each project.
CONFIGURATION & QUOTATIONSRequest a cooling quoteShare your server configuration and site conditions.Request a quote
Plan your cooling project
Our team will review server fit, heat rejection and the scope of supply.